Relocate booindex to OCRAM region after it gets opened by TIFS so
the main domain bootloaders can have access to this data.
Signed-off-by: Wadim Egorov <w.egorov@phytec.de>
AM62 SoC has multiple speed grades. Add function to return max A53 CPU
frequency based on grade. Fastest grade's max frequency also depends on
PMIC voltage, to simplify implementation use the smaller value.
Suggested-by: Vignesh Raghavendra <vigneshr@ti.com>
Signed-off-by: Joao Paulo Goncalves <joao.goncalves@toradex.com>
AM62x SoC is available in multiple temperature grade:
- Commercial: 0° to 95° C
- Industrial: -40° to 105° C
- Automotive: -40° to 125° C
Add a new function that returns the am62 max temperature value
accordingly to its temperature grade in Celsius.
Signed-off-by: Joao Paulo Goncalves <joao.goncalves@toradex.com>
Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
Add the Debounce configuration registers that need to be configured one
time for the platform for the entire SoC.
Signed-off-by: Nishanth Menon <nm@ti.com>
Add two functions, one which returns the SoC speed grade and one
which returns the SoC operating temperature range.
Signed-off-by: Max Krummenacher <max.krummenacher@toradex.com>
mach-k3/am625_fdt.c does fdt fixup depending on fields in the device
identification register. Move the accessors to the device identification
register as inline functions into the am62_hardware.h header, so that
they can be used for other functionality.
Signed-off-by: Max Krummenacher <max.krummenacher@toradex.com>
Add register address and relevant bitmasks and shifts.
Allow reading these information:
- device identification
- number of cores (part of device identification)
- features (currently: PRU / no PRU)
- security
- functional safety
- speed grade
- temperature grade
- package
Signed-off-by: Emanuele Ghidoli <emanuele.ghidoli@toradex.com>
Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
Reviewed-by: Andrew Davis <afd@ti.com>
This function is the same for each device when it needs to shutdown
the R5 core. Move this to the common section and move the remaining
device specific ID list to the device hardware include.
Signed-off-by: Andrew Davis <afd@ti.com>
Reviewed-by: Christian Gmeiner <christian.gmeiner@gmail.com>
On high security devices, ROM enables firewalls to protect the OCSRAM
region access during bootup. Only after TIFS has started (and had
time to disable the OCSRAM firewall region) will we have write access to
the region.
So, move scratch board area to HSM RAM.
Signed-off-by: Kamlesh Gurudasani <kamlesh@ti.com>
These hardware register definitions are common for all K3, remove
duplicate data them by moving them to hardware.h.
While here do some minor whitespace cleanup + grouping.
Signed-off-by: Andrew Davis <afd@ti.com>
On AM62x devices, main ESM error event outputs can be routed to
MCU ESM as inputs. So, two ESM device nodes are expected in the
device tree : one for main ESM and another one for MCU ESM.
MCU ESM error output can trigger the reset logic to reset
the device when CTRLMMR_MCU_RST_CTRL:MCU_ESM_ERROR_RESET_EN_Z is
set to '0'.
Signed-off-by: Julien Panis <jpanis@baylibre.com>
The AM62 SoC family is the follow on AM335x built on K3 Multicore SoC
architecture platform, providing ultra-low-power modes, dual display,
multi-sensor edge compute, security and other BOM-saving integration.
The AM62 SoC targets broad market to enable applications such as
Industrial HMI, PLC/CNC/Robot control, Medical Equipment, Building
Automation, Appliances and more.
Some highlights of this SoC are:
* Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster.
Pin-to-pin compatible options for single and quad core are available.
* Cortex-M4F for general-purpose or safety usage.
* Dual display support, providing 24-bit RBG parallel interface and
OLDI/LVDS-4 Lane x2, up to 200MHz pixel clock support for 2K display
resolution.
* Selectable GPUsupport, up to 8GFLOPS, providing better user experience
in 3D graphic display case and Android.
* PRU(Programmable Realtime Unit) support for customized programmable
interfaces/IOs.
* Integrated Giga-bit Ethernet switch supporting up to a total of two
external ports (TSN capable).
* 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, GPMC for
NAND/FPGA connection, OSPI memory controller, 3xMcASP for audio,
1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other peripherals.
* Dedicated Centralized System Controller for Security, Power, and
Resource Management.
* Multiple low power modes support, ex: Deep sleep,Standby, MCU-only,
enabling battery powered system design.
AM625 is the first device of the family. Add DT bindings for the same.
More details can be found in the Technical Reference Manual:
https://www.ti.com/lit/pdf/spruiv7
Signed-off-by: Suman Anna <s-anna@ti.com>
Signed-off-by: Gowtham Tammana <g-tammana@ti.com>
Signed-off-by: Aswath Govindraju <a-govindraju@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
